Subject: Re: Building New System
From: "Nick M V Salmon" <spam@dump>
Date: 23/02/2004, 23:23
Newsgroups: alt.sci.seti

"Magic User" <magicuser@nowhere.com> wrote
I am building a new system and was wondering what the deal is with
the heat sink for the socket 478 chip. The heat sink came with a thin
layer of material already applied where one would normally put
heatsink compound. It this stuff heatsink compound material and is
it any good?

Yes, it's a thermal transfer pad - they do work okay but usually not quite
as efficiently as a good quality thermal compound. make sure you remove the
plastic tape that's (usually) on top of the pad...

Ciao...

[UK]_Nick...
-- Nick M V Salmon Master Mariner MN(Retd.) Email: My four initials at dsl dot pipex dot com http://www.nmvs.dsl.pipex.com/index.htm