Magic User wrote:

I am building a new system and was wondering what the deal is with
the heat sink for the socket 478 chip. The heat sink came with a thin
layer of material already applied where one would normally put
heatsink compound. It this stuff heatsink compound material and is
it any good?

Yes, and yes.

It is a less gooey form of heatsink compound to ensure a good thermal contact.

Peel off any protective covering. The soft stuff then moulds itself to the chip package surface when under heat and slight pressure from the retaining clip.

Once in place, DON'T TOUCH! You'll break the good thermal contact. If ever removed or disturbed, you must replace it.


I prefer the old fashioned gooey stuff myself so that I can be careful about it and get the best thermal contact possible. However, the pre-prepared contact pads can be argued to be more reliable for novice assembly...


Good luck,
Martin